ASSIGNMENT No:2-PACKAGE TYPES

Processors Package Type Guide (Desktop Processors)


FC-LGA4 Package Type

The FC-LGA4 package is used with Pentium® 4 processors designed for the LGA775 socket. FC-LGA4 is short for Flip Chip Land Grid Array 4. FC (Flip Chip) means that the processor die is on top of the substrate on the opposite side from the LAND contacts. LGA (LAND Grid Array) refers to how the processor die is attached to the substrate. The number 4 stands for the revision number of the package. This package consists of a processor core mounted on a substrate land-carrier. An integrated Heat Spreader (IHS) is attached to the package substrate and core and serves as the mating surface for the processor component thermal solution such as a heatsink.You may also see references to processors in the 775-LAND package. This refers to the number of contacts that the new package contains that interface with the LGA775 socket. The pictures below include the LAND Slide Cover (LSC). This black cover protects the processor contacts from damage and contamination and should be retained and placed on the processor whenever it is removed from the LGA775 socket.

FC-PGA2 Package Type

FC-PGA2 packages are similar to the FC-PGA package type, except these processors also have an Integrated Heat Sink (IHS). The integrated heat sink is attached directly to the die of the processor during manufacturing. Since the IHS makes a good thermal contact with the die and it offers a larger surface area for better heat dissipation, it can significantly increase thermal conductivity. The FC-PGA2 package is used in Pentium III and Intel Celeron processor (370 pins) and the Pentium 4 processor (478 pins).

FC-PGA Package Type

The FC-PGA package is short for flip chip pin grid array, which have pins that are inserted into a socket. These chips are turned upside down so that the die or the part of the processor that makes up the computer chip is exposed on the top of the processor. By having the die exposed allows the thermal solution can be applied directly to the die, which allows for more efficient cooling of the chip. To enhance the performance of the package by decoupling the power and ground signals, FC-PGA processors have discrete capacitors and resistors on the bottom of the processor, in the capacitor placement area (center of processor). The pins on the bottom of the chip are staggered. In addition, the pins are arranged in a way that the processor can only be inserted one way into the socket. The FC-PGA package is used in Pentium® III and Intel® Celeron® processor.

S.E.C.C. Package Type

S.E.C.C. is short for Single Edge Contact Cartridge. To connect to the motherboard, the processor is inserted into a slot. Instead of having pins, it uses goldfinger contacts, which the processor uses to carry its signals back and forth. The S.E.C.C. is covered with a metal shell that covers the top of the entire cartridge assembly. The back of the cartridge is a thermal plate that acts as a heatsink. Inside the S.E.C.C., most processors have a printed circuit board called the substrate that links together the processor, the L2 cache and the bus termination circuits. The S.E.C.C. package was used in the Intel Pentium II processors, which have 242 contacts and the Pentium® II Xeon™ and Pentium III Xeon processors, which have 330 contacts.

CPGA (Ceramic Pin Grid Array)

CPGA stands for Ceramic Pin Grid Array, a type of connection for CPUs where the processor's die is attached to a heat-conducting ceramic plate which is pierced by an array of pins which make the requisite connections to the socket.

Popular CPUs that employ CPGA are the "classic" Socket A Athlon and the Duron, both from AMD.

OPGA (Organic Pin Grid Array )

The Organic Pin Grid Array (OPGA) is a type of connection for integrated circuits, and especially CPUs, where the silicon die is attached to a plate out of an organic plastic which is pierced by an array of pins which make the requisite connections to the socket.

CPU SOCKETS

Socket 370 (PGA370)

Socket 370 (also called PGA370) is a PGA socket designed to work with Intel Celeron and Pentium III processors in Pin Grid Array (PGA) package. There are three different revisions of the socket 370:

• Originally the Socket 370 (PGA370) was designed for Celeron Mendocino CPUs. These processors were manufactured in plastic PGA (PPGA) package, ran at speeds 300 MHz - 533 MHz, and had 66 MHz front-side bus and 2V core voltage. Original Socket 370 is not compatible with Coppermine and Tualatin Intel processors. It is possible to run Coppermine processors in this socket with the help of special PPGA-to-FC-PGA adapters, for example, PowerLeap PL-NeoS370.
• To support newer Coppermine Celeron and Pentium III processors Intel revised specifications for the socket 370. The revised socket was mechanically compatible with the original specification, but there were differences in electrical specifications. As a result, new Coppermine CPUs would not work in the original socket, even though they would fit into it. Revised Socket 370 supported Coppermine processors running at speeds 533 MHz - 1133 MHz with FSB 100 and 133 MHz and core voltages in the range from 1.5V to 1.8V. Tualatin Pentium III processors were not directly supported by the socket, though it was possible to run them in the socket with the help of Tualatin adapters (for example, PowerLeap Neo/T). Many motherboards with this PGA370 socket revision also supported Celeron processors in PPGA package.
• With the introduction of new Tualatin Pentium III core the socket 370 was revised once again. Like the previous revision of the socket, the second revision was mechanically compatible with old sockets, but electrically incompatible with previous socket revisions. This socket revision supported Tualatin processors in the range from 1 GHz to 1.4 GHz with FSB 100 and 133 MHz and core voltages 1.45V and 1.5V. Majority of motherboards with this revision of the socket 370 were also compatible with older Coppermine Pentium III and Celeron processors.

Visually it's not possible to distinguish between different revisions of the socket 370 (PGA370), they all look like the socket on the picture below:

The socket has 370 pin-holes - hence the name Socket 370, and it has the same size as the Socket 7. There are two differences between these sockets:

1. Socket 370 processors don't have 2 corner pins while Socket 7 processors don't have only one corner pin. The extra corner pin doesn't allow Socket 7 processors to fit into PGA370 socket.
2. There are 6 rows of pins between the edge and the center of the processor for Socket 370 processors, and 5 rows for Socket 7 processors.

Socket 462 (Socket A)

Socket 462 (also called Socket A) is a PGA socket designed for AMD K7 family of processors. This socket can be used with AMD Athlon and Duron processors ranging in speed from 600 MHz to 2200 MHz (3200+) and with bus frequences ranging from 100 MHz to 200 MHz (400 MHz DDR). For a full list of supported processors please see below. Socket A has 462 pin holes (hence the name "Socket 462") with 11 pluged pin holes. Socket dimensions are 5.59 cm (5.24 cm without lever) x 6.55 cm or 2.2" (2.06" without lever) x 2.58", which is almost the same as Socket 7/Super Socket 7. Supported processors Athlon (Socket A) (600 MHz - 1400 MHz) Athlon XP (1333 MHz - 2333 MHz, or 1500+ - 3200+) Athlon MP (1000 MHz - 2133 MHz) Duron (550 MHz - 1800 MHz) Sempron (socket A) (1500 MHz - 2200 MHz, or 2200+ - 3300+) Mobile Athlon 4 (850 MHz - 1400 MHz) Mobile Athlon XP-M (Socket A) (1200 MHz - 2200 MHz, or 1400+ - 3000+) Mobile Duron (650 MHz - 1200 MHz) Athlon 64, 64 FX, Sempron 64 and Opteron processors use different type of socket. There are no Intel or VIA processors compatible with this socket. NOTE: Not all processors may be supported by all motherboards. Please see "Upgrading socket 462 motherboards" section below on how to determine what microprocessors can be supported by your motherboard. Compatible sockets None. Compatible package types 462-pin ceramic Pin Grid Array (PGA) package, 462-pin organic PGA. Upgrading socket 462 motherboards While you can fit many socket 462 processors into your motherboard, not all of them may be supported by the board. To determine what processors are supported you'll need to: Determine manufacturer and model of your motherboard, Search on manufacturer's website for the motherboard model. To determine upgrade options for brand name computers (like Dell or HP) try to search for computer model on computer manufacturer website. For upgrade information for ASUS, DFI, ECS, Gigabyte Technology, Jetway, MSI and PC Chips motherboards please check CPU-Upgrade motherboard database.